Publications

@patent{RN50,

title = {Variable sensitivity acoustic transducer},

author = {Raymond C Rumpf and Charles M Newton},

url = {https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/6542244},

year  = {2003},

date = {2003-04-01},

urldate = {2003-04-01},

number = {US Patent 6,542,244},

abstract = {The gauge length of an acoustic signal detector is dynamically variable by adjusting the location of an induced light reflection interface within a section of optical waveguide to which an acoustic stimulus is coupled. In an interferometer based architecture, a light beam is applied to each of an `acoustic signal detection` optical waveguide and a `reference` optical waveguide. The `acoustic signal detection` waveguide is coupled to an acoustic energy transmission element. The acoustic input modifies the index of refraction of the optical waveguide and modulates the light passing through the waveguide. Since the index of refraction of the optical waveguide section is modified by the acoustic stimulus, the signal beam has a phase delay dependent upon the acoustic signal and the distance between one end of the signal waveguide section and an induced reflection interface. The `reference` optical waveguide section also contains a reflection interface, the induced location of which is ganged with that of the signal optical waveguide section. The `signal` path and `reference` path beams reflected by their reflection interfaces are combined and applied to a photo-detector. The index of refraction of the material of the signal optical waveguide section is modified by the acoustic stimulus is the `signal path`. This `signal` path light beam is combined out of phase with `reference` light beam at the photo-detector. US Patent 6542244},

keywords = {},

pubstate = {published},

tppubtype = {patent}

}

@patent{RN41,

title = {Electronic module including a cooling substrate having a fluid cooling circuit therein and related methods},

author = {Brian Ronald Smith and Raymond Charles Rumpf and Charles Michael Newton},

url = {https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/6452798},

year  = {2002},

date = {2002-09-17},

urldate = {2002-09-17},

number = {US Patent 6,452,798},

abstract = {A method for making an electronic module includes forming a cooling substrate having a fluid cooling circuit therein having a vertical passageway. The cooling substrate may be formed by forming a plurality of unsintered ceramic layers having passageways therein. The plurality of unsintered ceramic layers and at least one resistive element may be assembled in stacked relation so that the passageways align to define the fluid cooling circuit and so that the at least one resistive element extends in a cantilever fashion into the vertical passageway. Furthermore, the unsintered ceramic layers and the at least one resistive element may be heated to sinter and to cause the at least one resistive element to soften and deform downwardly adjacent vertical sidewall portions of the vertical passageway. The method may also include mounting at least one electronic device on the cooling substrate in thermal communication with the fluid cooling circuit. US Patent 6452798},

keywords = {},

pubstate = {published},

tppubtype = {patent}

}

@patent{RN21,

title = {Thermally enhanced microcircuit package and method of forming same},

author = {Charles M Newton and Carol A Gamlen and Raymond C Rumpf Jr},

url = {https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/6437981},

year  = {2002},

date = {2002-08-20},

urldate = {2002-08-20},

number = {US Patent 6,437,981},

abstract = {A thermally enhanced microcircuit package includes a microcircuit package having a microcircuit device cavity that receives a microcircuit device. A microelectromechanical (MEMS) cooling module is operatively connected to the microcircuit package and forms a capillary pumped loop cooling circuit having an evaporator, condenser and interconnecting cooling fluid channels for passing vapor and fluid between the evaporator and condenser and evaporating and condensing the cooling fluid. The evaporator is operatively associated with the microcircuit device for cooling the device when in use. US Patent 6,437,981},

keywords = {},

pubstate = {published},

tppubtype = {patent}

}