2004
Rumpf, Raymond C; Johnson, Eric G
Microphotonic systems utilizing SU-8 Proceedings Article
In: MOEMS and Miniaturized Systems IV, pp. 64-72, International Society for Optics and Photonics, 2004.
Abstract | Links | BibTeX | Tags: lithography, photoresist, SU-8
@inproceedings{RN33,
title = {Microphotonic systems utilizing SU-8},
author = {Raymond C Rumpf and Eric G Johnson},
url = {https://www.spiedigitallibrary.org/conference-proceedings-of-spie/5346/1/Microphotonic-systems-utilizing-SU-8/10.1117/12.533352.short},
doi = {https://doi.org/10.1117/12.533352},
year = {2004},
date = {2004-01-24},
booktitle = {MOEMS and Miniaturized Systems IV},
volume = {5346},
pages = {64-72},
publisher = {International Society for Optics and Photonics},
abstract = {SU-8 is a negative-tone photoresist that can serve as a complete optical bench for micro-photonic systems. Functional optical devices and passive alignment structures can all be formed in the same material system with common processing steps. Many interrelated process parameters control the final geometry of structures formed in SU-8, but all can be accurately simulated and predicted by computer modeling. In this work, a comprehensive model of the lithography process was developed and combined with rigorous electromagnetic simulation. It was applied to predict sidewall slope of a tall structures as well as the geometry and transmission spectra of a three-dimensional photonic crystal. The model is seen as an enabling step toward realizing optimized micro-photonic systems in SU-8.},
keywords = {lithography, photoresist, SU-8},
pubstate = {published},
tppubtype = {inproceedings}
}
SU-8 is a negative-tone photoresist that can serve as a complete optical bench for micro-photonic systems. Functional optical devices and passive alignment structures can all be formed in the same material system with common processing steps. Many interrelated process parameters control the final geometry of structures formed in SU-8, but all can be accurately simulated and predicted by computer modeling. In this work, a comprehensive model of the lithography process was developed and combined with rigorous electromagnetic simulation. It was applied to predict sidewall slope of a tall structures as well as the geometry and transmission spectra of a three-dimensional photonic crystal. The model is seen as an enabling step toward realizing optimized micro-photonic systems in SU-8.
2003
Rumpf, Raymond C; Newton, Charles M
MEMS reconfigurable optical grating Patent
US Patent 6,628,851, 2003.
Abstract | Links | BibTeX | Tags:
@patent{RN47,
title = {MEMS reconfigurable optical grating},
author = {Raymond C Rumpf and Charles M Newton},
url = {https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/6628851},
year = {2003},
date = {2003-09-30},
urldate = {2003-09-30},
number = {US Patent 6,628,851},
abstract = {A tunable grating apparatus includes a plurality of grating structures contained within an optical transmission path. A microelectromechanical (MEMS) actuator is operatively connected to each grating structure for changing the separation between the grating structures and tuning the grating to a desired wavelength selectivity. The grating structures preferably form a Bragg grating. US Patent 6628851},
keywords = {},
pubstate = {published},
tppubtype = {patent}
}
A tunable grating apparatus includes a plurality of grating structures contained within an optical transmission path. A microelectromechanical (MEMS) actuator is operatively connected to each grating structure for changing the separation between the grating structures and tuning the grating to a desired wavelength selectivity. The grating structures preferably form a Bragg grating. US Patent 6628851
Rumpf, Raymond C; Newton, Charles M
Variable sensitivity acoustic transducer Patent
US Patent 6,542,244, 2003.
Abstract | Links | BibTeX | Tags:
@patent{RN50,
title = {Variable sensitivity acoustic transducer},
author = {Raymond C Rumpf and Charles M Newton},
url = {https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/6542244},
year = {2003},
date = {2003-04-01},
urldate = {2003-04-01},
number = {US Patent 6,542,244},
abstract = {The gauge length of an acoustic signal detector is dynamically variable by adjusting the location of an induced light reflection interface within a section of optical waveguide to which an acoustic stimulus is coupled. In an interferometer based architecture, a light beam is applied to each of an `acoustic signal detection` optical waveguide and a `reference` optical waveguide. The `acoustic signal detection` waveguide is coupled to an acoustic energy transmission element. The acoustic input modifies the index of refraction of the optical waveguide and modulates the light passing through the waveguide. Since the index of refraction of the optical waveguide section is modified by the acoustic stimulus, the signal beam has a phase delay dependent upon the acoustic signal and the distance between one end of the signal waveguide section and an induced reflection interface. The `reference` optical waveguide section also contains a reflection interface, the induced location of which is ganged with that of the signal optical waveguide section. The `signal` path and `reference` path beams reflected by their reflection interfaces are combined and applied to a photo-detector. The index of refraction of the material of the signal optical waveguide section is modified by the acoustic stimulus is the `signal path`. This `signal` path light beam is combined out of phase with `reference` light beam at the photo-detector. US Patent 6542244},
keywords = {},
pubstate = {published},
tppubtype = {patent}
}
The gauge length of an acoustic signal detector is dynamically variable by adjusting the location of an induced light reflection interface within a section of optical waveguide to which an acoustic stimulus is coupled. In an interferometer based architecture, a light beam is applied to each of an `acoustic signal detection` optical waveguide and a `reference` optical waveguide. The `acoustic signal detection` waveguide is coupled to an acoustic energy transmission element. The acoustic input modifies the index of refraction of the optical waveguide and modulates the light passing through the waveguide. Since the index of refraction of the optical waveguide section is modified by the acoustic stimulus, the signal beam has a phase delay dependent upon the acoustic signal and the distance between one end of the signal waveguide section and an induced reflection interface. The `reference` optical waveguide section also contains a reflection interface, the induced location of which is ganged with that of the signal optical waveguide section. The `signal` path and `reference` path beams reflected by their reflection interfaces are combined and applied to a photo-detector. The index of refraction of the material of the signal optical waveguide section is modified by the acoustic stimulus is the `signal path`. This `signal` path light beam is combined out of phase with `reference` light beam at the photo-detector. US Patent 6542244
2002
Smith, Brian Ronald; Rumpf, Raymond Charles; Newton, Charles Michael
US Patent 6,452,798, 2002.
Abstract | Links | BibTeX | Tags:
@patent{RN41,
title = {Electronic module including a cooling substrate having a fluid cooling circuit therein and related methods},
author = {Brian Ronald Smith and Raymond Charles Rumpf and Charles Michael Newton},
url = {https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/6452798},
year = {2002},
date = {2002-09-17},
urldate = {2002-09-17},
number = {US Patent 6,452,798},
abstract = {A method for making an electronic module includes forming a cooling substrate having a fluid cooling circuit therein having a vertical passageway. The cooling substrate may be formed by forming a plurality of unsintered ceramic layers having passageways therein. The plurality of unsintered ceramic layers and at least one resistive element may be assembled in stacked relation so that the passageways align to define the fluid cooling circuit and so that the at least one resistive element extends in a cantilever fashion into the vertical passageway. Furthermore, the unsintered ceramic layers and the at least one resistive element may be heated to sinter and to cause the at least one resistive element to soften and deform downwardly adjacent vertical sidewall portions of the vertical passageway. The method may also include mounting at least one electronic device on the cooling substrate in thermal communication with the fluid cooling circuit. US Patent 6452798},
keywords = {},
pubstate = {published},
tppubtype = {patent}
}
A method for making an electronic module includes forming a cooling substrate having a fluid cooling circuit therein having a vertical passageway. The cooling substrate may be formed by forming a plurality of unsintered ceramic layers having passageways therein. The plurality of unsintered ceramic layers and at least one resistive element may be assembled in stacked relation so that the passageways align to define the fluid cooling circuit and so that the at least one resistive element extends in a cantilever fashion into the vertical passageway. Furthermore, the unsintered ceramic layers and the at least one resistive element may be heated to sinter and to cause the at least one resistive element to soften and deform downwardly adjacent vertical sidewall portions of the vertical passageway. The method may also include mounting at least one electronic device on the cooling substrate in thermal communication with the fluid cooling circuit. US Patent 6452798
Newton, Charles M; Gamlen, Carol A; Jr, Raymond C Rumpf
Thermally enhanced microcircuit package and method of forming same Patent
US Patent 6,437,981, 2002.
Abstract | Links | BibTeX | Tags:
@patent{RN21,
title = {Thermally enhanced microcircuit package and method of forming same},
author = {Charles M Newton and Carol A Gamlen and Raymond C Rumpf Jr},
url = {https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/6437981},
year = {2002},
date = {2002-08-20},
urldate = {2002-08-20},
number = {US Patent 6,437,981},
abstract = {A thermally enhanced microcircuit package includes a microcircuit package having a microcircuit device cavity that receives a microcircuit device. A microelectromechanical (MEMS) cooling module is operatively connected to the microcircuit package and forms a capillary pumped loop cooling circuit having an evaporator, condenser and interconnecting cooling fluid channels for passing vapor and fluid between the evaporator and condenser and evaporating and condensing the cooling fluid. The evaporator is operatively associated with the microcircuit device for cooling the device when in use. US Patent 6,437,981},
keywords = {},
pubstate = {published},
tppubtype = {patent}
}
A thermally enhanced microcircuit package includes a microcircuit package having a microcircuit device cavity that receives a microcircuit device. A microelectromechanical (MEMS) cooling module is operatively connected to the microcircuit package and forms a capillary pumped loop cooling circuit having an evaporator, condenser and interconnecting cooling fluid channels for passing vapor and fluid between the evaporator and condenser and evaporating and condensing the cooling fluid. The evaporator is operatively associated with the microcircuit device for cooling the device when in use. US Patent 6,437,981