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Raymond Rumpf

Professor, Innovator, Author, Researcher

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EMLab Research Featured on Cover of IEEE Components, Packaging, and Manufacturing Technology

2021-08-15 by Raymond Rumpf

The EM Lab published two seminal papers this month in IEEE Components, Packaging, and Manufacturing Technology. The first paper describes their work which automated hybrid direct-write 3D printing, giving them the powerful capability to build arbitrary metal-dielectric parts. The EM Lab is the first group in the world to accomplish this. The second paper describes how this new capability was used to build demonstrate the first-ever 3D/volumetric electrical circuit. The second paper also described the EM Lab’s custom CAD tool to design 3D/volumetric circuits. With these unique capabilities, the future is very bright for the EM Lab.

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Category iconEMLab,  Publications,  Research

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