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Raymond Rumpf

Professor, Innovator, Author, Researcher

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EMLab

2021-08-15

EMLab Research Featured on Cover of IEEE Components, Packaging, and Manufacturing Technology

The EM Lab published two seminal papers this month in IEEE Components, Packaging, and Manufacturing Technology. The first paper describes their work which automated hybrid direct-write 3D printing, giving them the powerful capability to build arbitrary metal-dielectric parts. The EM Lab is the first group in the world to accomplish this. The second paper describes […]

Category iconEMLab,  Publications,  Research

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