• Skip to primary navigation
  • Skip to main content
  • Skip to footer

info@raymond.rumpf.com

  • Email
  • Facebook
  • LinkedIn
  • YouTube
Raymond Rumpf logo

Raymond Rumpf

Professor, Innovator, Author, Researcher

  • Course Offerings
    • Academic Materials
    • EMPossible Courses
  • Research
    • EMLab
    • Hybrid 3D Printing
    • 3D Printed Electronics
    • Spatially Variant Lattices
    • Photonics
    • Electromagnetics
    • Computational Electromagnetics
    • EMLab Capabilities
  • Publications
  • News
  • About Dr. Rumpf
Contact Us

Publications

ResearchGate Profile
Google Scholar Profile

Show all

2019

Robles, Ubaldo; Bustamante, Edgar; Darshni, Prya; Rumpf, Raymond C

High-Frequency Filters Manufactured Using Hybrid 3D Printing Method Journal Article

In: Progress In Electromagnetics Research, vol. 84, pp. 147-155, 2019, ISSN: 1937-8726.

Abstract | Links | BibTeX | Tags: high-frequency filters, hybrid 3D printing

@article{RN145,
title = {High-Frequency Filters Manufactured Using Hybrid 3D Printing Method},
author = {Ubaldo Robles and Edgar Bustamante and Prya Darshni and Raymond C Rumpf},
url = {https://www.jpier.org/PIERM/pier.php?paper=18102603},
issn = {1937-8726},
year = {2019},
date = {2019-08-27},
journal = {Progress In Electromagnetics Research},
volume = {84},
pages = {147-155},
abstract = {In this work, two different high-frequency filters were produced, and each was manufactured in two different ways, one using conventional PCB technology and the other using hybrid 3D printing. The hybrid 3D printing technique combined the use of microdispensing of conductive inks and fused filament fabrication (FFF) of thermoplastic substrates. Measurements, properties, and comparisons between these filters are discussed. The goal of the research was to benchmark 3D printing of high-frequency filters to more confidently manufacture sophisticated devices and high-frequency systems by hybrid 3D printing.},
keywords = {high-frequency filters, hybrid 3D printing},
pubstate = {published},
tppubtype = {article}
}

Close

In this work, two different high-frequency filters were produced, and each was manufactured in two different ways, one using conventional PCB technology and the other using hybrid 3D printing. The hybrid 3D printing technique combined the use of microdispensing of conductive inks and fused filament fabrication (FFF) of thermoplastic substrates. Measurements, properties, and comparisons between these filters are discussed. The goal of the research was to benchmark 3D printing of high-frequency filters to more confidently manufacture sophisticated devices and high-frequency systems by hybrid 3D printing.

Close

  • https://www.jpier.org/PIERM/pier.php?paper=18102603

Close

Carranza, Gilbert T; Robles, Ubaldo; Valle, Cesar L; Gutierrez, Jesus J; Rumpf, Raymond C

Design and hybrid additive manufacturing of 3-D/volumetric electrical circuits Journal Article

In: IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 9, no. 6, pp. 1176-1183, 2019, ISSN: 2156-3950.

Abstract | Links | BibTeX | Tags: circuit design, circuit design, electronics packaging, FDM, fused deposition modeling, hybrid 3D printing, microdispensing, printed circuit, signal routing

@article{RN137,
title = {Design and hybrid additive manufacturing of 3-D/volumetric electrical circuits},
author = {Gilbert T Carranza and Ubaldo Robles and Cesar L Valle and Jesus J Gutierrez and Raymond C Rumpf},
url = {https://ieeexplore.ieee.org/document/8610012},
doi = {10.1109/TCPMT.2019.2892389},
issn = {2156-3950},
year = {2019},
date = {2019-01-11},
journal = {IEEE Transactions on Components, Packaging and Manufacturing Technology},
volume = {9},
number = {6},
pages = {1176-1183},
abstract = {For the first time, a fully 3-D electric circuit was modeled in a 3-D environment and manufactured via an automated hybrid direct-write 3-D printing process. The implications and applications of this significant achievement are enormous because it allows circuits to be designed and manufactured in virtually any form factor. To accomplish this, a custom computer-aided design (CAD) tool was programmed into an open-source modeling software to layout components and route interconnects. The custom CAD tool imports the netlist and component geometries from a schematic capture program. Components can be placed at any position and be oriented at any angle. Interconnects can meander smoothly throughout the circuit following 3-D splines. The interconnects can be placed manually or automatically between components. After laying out the components and routing interconnects, the tool exports Standard Tessellation Language files of the dielectric and metal portions of the final circuit to be 3-D printed. To manufacture the circuit, fused-deposition modeling of acrylonitrile butadiene styrene plastic and microdispensing (μD) of DuPont CB028 silver paste was used. To demonstrate, a functional 555 timer circuit was designed and built to flash an LED.},
keywords = {circuit design, circuit design, electronics packaging, FDM, fused deposition modeling, hybrid 3D printing, microdispensing, printed circuit, signal routing},
pubstate = {published},
tppubtype = {article}
}

Close

For the first time, a fully 3-D electric circuit was modeled in a 3-D environment and manufactured via an automated hybrid direct-write 3-D printing process. The implications and applications of this significant achievement are enormous because it allows circuits to be designed and manufactured in virtually any form factor. To accomplish this, a custom computer-aided design (CAD) tool was programmed into an open-source modeling software to layout components and route interconnects. The custom CAD tool imports the netlist and component geometries from a schematic capture program. Components can be placed at any position and be oriented at any angle. Interconnects can meander smoothly throughout the circuit following 3-D splines. The interconnects can be placed manually or automatically between components. After laying out the components and routing interconnects, the tool exports Standard Tessellation Language files of the dielectric and metal portions of the final circuit to be 3-D printed. To manufacture the circuit, fused-deposition modeling of acrylonitrile butadiene styrene plastic and microdispensing (μD) of DuPont CB028 silver paste was used. To demonstrate, a functional 555 timer circuit was designed and built to flash an LED.

Close

  • https://ieeexplore.ieee.org/document/8610012
  • doi:10.1109/TCPMT.2019.2892389

Close

2017

Avila, Jose; Valle, Cesar L; Bustamante, Edgar; Rumpf, Raymond C

Optimization and Characterization of Negative Uniaxial Metamaterials Journal Article

In: Progress In Electromagnetics Research C, vol. 74, pp. 111-121, 2017, ISSN: 1937-8718.

Abstract | Links | BibTeX | Tags: birefringent, dielectrics, hybrid 3D printing, negative uniaxial metamaterials

@article{RN123,
title = {Optimization and Characterization of Negative Uniaxial Metamaterials},
author = {Jose Avila and Cesar L Valle and Edgar Bustamante and Raymond C Rumpf},
url = {https://www.jpier.org/pierc/pier.php?paper=17030906},
doi = {doi:10.2528/PIERC17030906},
issn = {1937-8718},
year = {2017},
date = {2017-05-23},
urldate = {2017-05-23},
journal = {Progress In Electromagnetics Research C},
volume = {74},
pages = {111-121},
abstract = {Digital manufacturing, or 3D printing, is a rapidly emerging technology that enables novel designs that incorporate complex geometries and even multiple materials. In electromagnetics and circuits, 3D printing allows the dielectrics to take on new and profound functionality. This paper introduces negative uniaxial metamaterials (NUMs) which are birefringent structures that can be used to manipulate electromagnetic fields at a very small scale. The NUMs presented here are composed of alternating layers of two different dielectrics. The physics of the NUMs are explained and simple analytical equations for the effective dielectric tensor are derived. Using these equations, the NUMs are optimized for strength of anisotropy and for space stretching derived from transformation optics. The analytical equations are validated through rigorous simulations and by laboratory measurements. Three NUMs where manufactured using 3D printing where each exhibited anisotropy in a different orientation for measurement purposes. All of the data from the analytical equations, simulations, and experiments are in excellent agreement confirming that the physics of the NUMs is well understood and that NUMs can be designed quickly and easily using just the analytical equations.},
keywords = {birefringent, dielectrics, hybrid 3D printing, negative uniaxial metamaterials},
pubstate = {published},
tppubtype = {article}
}

Close

Digital manufacturing, or 3D printing, is a rapidly emerging technology that enables novel designs that incorporate complex geometries and even multiple materials. In electromagnetics and circuits, 3D printing allows the dielectrics to take on new and profound functionality. This paper introduces negative uniaxial metamaterials (NUMs) which are birefringent structures that can be used to manipulate electromagnetic fields at a very small scale. The NUMs presented here are composed of alternating layers of two different dielectrics. The physics of the NUMs are explained and simple analytical equations for the effective dielectric tensor are derived. Using these equations, the NUMs are optimized for strength of anisotropy and for space stretching derived from transformation optics. The analytical equations are validated through rigorous simulations and by laboratory measurements. Three NUMs where manufactured using 3D printing where each exhibited anisotropy in a different orientation for measurement purposes. All of the data from the analytical equations, simulations, and experiments are in excellent agreement confirming that the physics of the NUMs is well understood and that NUMs can be designed quickly and easily using just the analytical equations.

Close

  • https://www.jpier.org/pierc/pier.php?paper=17030906
  • doi:doi:10.2528/PIERC17030906

Close

2016

Rodriguez, Carlos; Avila, Jose; Rumpf, Raymond C

Ultra-thin 3D printed all-dielectric antenna Journal Article

In: Progress In Electromagnetics Research C, vol. 64, pp. 117-123, 2016, ISSN: 1937-8718.

Abstract | Links | BibTeX | Tags: 3D printing, all-dielectric antenna, hybrid 3D printing

@article{RN109,
title = {Ultra-thin 3D printed all-dielectric antenna},
author = {Carlos Rodriguez and Jose Avila and Raymond C Rumpf},
url = {https://www.jpier.org/PIERC/pier.php?paper=16020602},
doi = {doi:10.2528/PIERC16020602},
issn = {1937-8718},
year = {2016},
date = {2016-05-26},
journal = {Progress In Electromagnetics Research C},
volume = {64},
pages = {117-123},
abstract = {In this work we report an ultra-thin all-dielectric antenna that was designed, built, tested, and compared with simulated data. The objective of this research was to develop an antenna that is easily manufactured by common 3-D printers available today. 3-D printing is quickly revolutionizing manufacturing and the need to incorporate electrical elements like antennas is rising. Multi-material 3-D printing that can build parts with conductors and dielectrics is the future, but at present it is very immature and largely inaccessible. The antenna presented here represents our first steps in developing all-dielectric antennas that can be manufactured today with commonly available 3-D printers and materials. A monolithic antenna would have additional mechanical benefits when subjected to bending or thermal cycling. With this goal in mind, an ultra-thin all-dielectric antenna was developed. The antenna operates by taking advantage of total internal reflection and exciting a leaky whispering gallery mode. The antenna reported here operates at 2.4 GHz and was able to be as thin as 1.5 mm.},
keywords = {3D printing, all-dielectric antenna, hybrid 3D printing},
pubstate = {published},
tppubtype = {article}
}

Close

In this work we report an ultra-thin all-dielectric antenna that was designed, built, tested, and compared with simulated data. The objective of this research was to develop an antenna that is easily manufactured by common 3-D printers available today. 3-D printing is quickly revolutionizing manufacturing and the need to incorporate electrical elements like antennas is rising. Multi-material 3-D printing that can build parts with conductors and dielectrics is the future, but at present it is very immature and largely inaccessible. The antenna presented here represents our first steps in developing all-dielectric antennas that can be manufactured today with commonly available 3-D printers and materials. A monolithic antenna would have additional mechanical benefits when subjected to bending or thermal cycling. With this goal in mind, an ultra-thin all-dielectric antenna was developed. The antenna operates by taking advantage of total internal reflection and exciting a leaky whispering gallery mode. The antenna reported here operates at 2.4 GHz and was able to be as thin as 1.5 mm.

Close

  • https://www.jpier.org/PIERC/pier.php?paper=16020602
  • doi:doi:10.2528/PIERC16020602

Close

Footer

Sitemap

  • Course Offerings
  • Research
  • Publications
  • News
  • About Dr. Rumpf
  • Home

Connect with me

  • Email
  • LinkedIn
  • YouTube

Copyright © 2026 Raymond C. Rumpf. All rights reserved. Return to top