2019
Carranza, Gilbert T; Robles, Ubaldo; Valle, Cesar L; Gutierrez, Jesus J; Rumpf, Raymond C
Design and hybrid additive manufacturing of 3-D/volumetric electrical circuits Journal Article
In: IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 9, no. 6, pp. 1176-1183, 2019, ISSN: 2156-3950.
Abstract | Links | BibTeX | Tags: circuit design, circuit design, electronics packaging, FDM, fused deposition modeling, hybrid 3D printing, microdispensing, printed circuit, signal routing
@article{RN137,
title = {Design and hybrid additive manufacturing of 3-D/volumetric electrical circuits},
author = {Gilbert T Carranza and Ubaldo Robles and Cesar L Valle and Jesus J Gutierrez and Raymond C Rumpf},
url = {https://ieeexplore.ieee.org/document/8610012},
doi = {10.1109/TCPMT.2019.2892389},
issn = {2156-3950},
year = {2019},
date = {2019-01-11},
journal = {IEEE Transactions on Components, Packaging and Manufacturing Technology},
volume = {9},
number = {6},
pages = {1176-1183},
abstract = {For the first time, a fully 3-D electric circuit was modeled in a 3-D environment and manufactured via an automated hybrid direct-write 3-D printing process. The implications and applications of this significant achievement are enormous because it allows circuits to be designed and manufactured in virtually any form factor. To accomplish this, a custom computer-aided design (CAD) tool was programmed into an open-source modeling software to layout components and route interconnects. The custom CAD tool imports the netlist and component geometries from a schematic capture program. Components can be placed at any position and be oriented at any angle. Interconnects can meander smoothly throughout the circuit following 3-D splines. The interconnects can be placed manually or automatically between components. After laying out the components and routing interconnects, the tool exports Standard Tessellation Language files of the dielectric and metal portions of the final circuit to be 3-D printed. To manufacture the circuit, fused-deposition modeling of acrylonitrile butadiene styrene plastic and microdispensing (μD) of DuPont CB028 silver paste was used. To demonstrate, a functional 555 timer circuit was designed and built to flash an LED.},
keywords = {circuit design, circuit design, electronics packaging, FDM, fused deposition modeling, hybrid 3D printing, microdispensing, printed circuit, signal routing},
pubstate = {published},
tppubtype = {article}
}
For the first time, a fully 3-D electric circuit was modeled in a 3-D environment and manufactured via an automated hybrid direct-write 3-D printing process. The implications and applications of this significant achievement are enormous because it allows circuits to be designed and manufactured in virtually any form factor. To accomplish this, a custom computer-aided design (CAD) tool was programmed into an open-source modeling software to layout components and route interconnects. The custom CAD tool imports the netlist and component geometries from a schematic capture program. Components can be placed at any position and be oriented at any angle. Interconnects can meander smoothly throughout the circuit following 3-D splines. The interconnects can be placed manually or automatically between components. After laying out the components and routing interconnects, the tool exports Standard Tessellation Language files of the dielectric and metal portions of the final circuit to be 3-D printed. To manufacture the circuit, fused-deposition modeling of acrylonitrile butadiene styrene plastic and microdispensing (μD) of DuPont CB028 silver paste was used. To demonstrate, a functional 555 timer circuit was designed and built to flash an LED.
2018
Robles, Ubaldo; Kasemodel, Justin; Avila, Jose; Benitez, Tenoch; Rumpf, Raymond C
3-d printed structures by microdispensing materials loaded with dielectric and magnetic powders Journal Article
In: IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 8, no. 3, pp. 492-498, 2018, ISSN: 2156-3950.
Abstract | Links | BibTeX | Tags: 3D printing, dielectrics, magnetic properties, microdispensing
@article{RN131,
title = {3-d printed structures by microdispensing materials loaded with dielectric and magnetic powders},
author = {Ubaldo Robles and Justin Kasemodel and Jose Avila and Tenoch Benitez and Raymond C Rumpf},
url = {https://ieeexplore.ieee.org/document/8263403},
doi = {10.1109/TCPMT.2017.2781723},
issn = {2156-3950},
year = {2018},
date = {2018-03-01},
urldate = {2018-03-01},
journal = {IEEE Transactions on Components, Packaging and Manufacturing Technology},
volume = {8},
number = {3},
pages = {492-498},
abstract = {In this paper, we develop processes for printing 3-D structures by microdispensing materials loaded with dielectric and magnetic powders. Manufacturing with these materials is demonstrated by 3-D printing simple tower and bridge structures. The dielectric and magnetic properties are adjusted by loading different amounts of powder into a host silicone material. The long-term goal of the research is to print larger and more complex structures while also realizing a range of electromagnetic properties for applications in 3-D printed electromagnetics.},
keywords = {3D printing, dielectrics, magnetic properties, microdispensing},
pubstate = {published},
tppubtype = {article}
}
In this paper, we develop processes for printing 3-D structures by microdispensing materials loaded with dielectric and magnetic powders. Manufacturing with these materials is demonstrated by 3-D printing simple tower and bridge structures. The dielectric and magnetic properties are adjusted by loading different amounts of powder into a host silicone material. The long-term goal of the research is to print larger and more complex structures while also realizing a range of electromagnetic properties for applications in 3-D printed electromagnetics.