2018
Robles, Ubaldo; Kasemodel, Justin; Avila, Jose; Benitez, Tenoch; Rumpf, Raymond C
3-d printed structures by microdispensing materials loaded with dielectric and magnetic powders Journal Article
In: IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 8, no. 3, pp. 492-498, 2018, ISSN: 2156-3950.
Abstract | Links | BibTeX | Tags: 3D printing, dielectrics, magnetic properties, microdispensing
@article{RN131,
title = {3-d printed structures by microdispensing materials loaded with dielectric and magnetic powders},
author = {Ubaldo Robles and Justin Kasemodel and Jose Avila and Tenoch Benitez and Raymond C Rumpf},
url = {https://ieeexplore.ieee.org/document/8263403},
doi = {10.1109/TCPMT.2017.2781723},
issn = {2156-3950},
year = {2018},
date = {2018-03-01},
urldate = {2018-03-01},
journal = {IEEE Transactions on Components, Packaging and Manufacturing Technology},
volume = {8},
number = {3},
pages = {492-498},
abstract = {In this paper, we develop processes for printing 3-D structures by microdispensing materials loaded with dielectric and magnetic powders. Manufacturing with these materials is demonstrated by 3-D printing simple tower and bridge structures. The dielectric and magnetic properties are adjusted by loading different amounts of powder into a host silicone material. The long-term goal of the research is to print larger and more complex structures while also realizing a range of electromagnetic properties for applications in 3-D printed electromagnetics.},
keywords = {3D printing, dielectrics, magnetic properties, microdispensing},
pubstate = {published},
tppubtype = {article}
}
In this paper, we develop processes for printing 3-D structures by microdispensing materials loaded with dielectric and magnetic powders. Manufacturing with these materials is demonstrated by 3-D printing simple tower and bridge structures. The dielectric and magnetic properties are adjusted by loading different amounts of powder into a host silicone material. The long-term goal of the research is to print larger and more complex structures while also realizing a range of electromagnetic properties for applications in 3-D printed electromagnetics.